Every factory that uses
lead-free solder paste hopes to help electronic products perform a perfect soldering. However, this matter is not a very simple matter. To achieve such an effect, several points must be achieved:
Technical introduction that requires special attention when printing lead-free solder paste:
1. Daily items such as scrapers and stencils must be checked before printing. Make sure it is clean and tidy, without dust and any sundries (clean up if necessary) to prevent lead-free solder paste from being polluted and directly affecting the tin drop performance; the scraper edge should be straight and free of defects. The stencil should be straight with little distortion. There should be no hard lumps of residual tin paste or other debris on the edge of the slot.
2. The bottom plate should be fixed with a fixture or a vacuum device to prevent the PCB from shifting during the printing process and increase the separation of the stencil after printing;
3. Adjust the position of the stencil and the PCB to match each other as closely as possible (the gap will lead to tin leakage, and the horizontal misalignment will also cause the solder paste to be printed outside the pad);
4. At the beginning of printing, the lead-free solder paste on the stencil should not be too much. Most A5 stencils add 200g, B5 stencils add 300g, A4 stencils add 400g;
5. As the printing production continues, the amount of lead-free solder paste on the stencil will decrease significantly, and a certain amount of high-quality lead-free solder paste should be added at an appropriate time.
Soldering any soldering surface with lead-free solder paste requires a solid and clean appearance, especially on the surface gloss.
Soldering temples with lead-free solder paste do not miss unsoldered places. Lead-free solder paste will not cause false soldering, tombstone, tin connection, residue, etc. due to overheating or insufficient working temperature.
Lead-free solder paste penetrates joints in many ways. Whether the entire exposed part of the circuit board should be covered with lead-free solder paste.
Absolutely, if there is a joining part of the soldering part of raw materials and lead-free solder paste, it cannot be deteriorated or destroyed by heating.
The rosin in the lead-free solder paste must not scatter and intrude into the contact parts or leave excess gaps.
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