Laser soldering principle:

Laser soldering is a laser welding technology that uses laser as a heat source to heat solder paste and melt it. It is widely used in the electronics and automotive industries, such as the production process of PCB boards, FPCB boards, and connecting terminals. Laser welding can be divided into several common application methods such as laser wire-feed welding, laser solder paste welding, and laser solder ball welding from the use of different consumables.

Compared with the traditional electric soldering iron process, laser soldering has irreplaceable advantages. The technology is more advanced, and the heating principle is also different from the traditional craft. He did not simply replace the heating part of the soldering iron, and rely on "heat transfer" to slowly heat up the temperature, but it belongs to "surface heat release", and the heating speed is extremely fast. Its main feature is to use the high energy of the laser to achieve rapid heating of local or small areas to complete the soldering process. the

Laser soldering process:

1. Laser irradiation on the part to be welded to reach the melting temperature of the solder

3. After the material supply is completed, continue to irradiate to realize welding

4. Continue to irradiate, solder joint shaping

5. After shaping, turn off the laser

The light source of laser welding adopts laser light-emitting diode, which can be precisely focused on the welding spot through the optical system. After that, the solder paste used for soldering is completely melted, and the solder completely wets the pad, finally forming a solder joint. Welding with laser generator and optical focusing components, high energy density, high heat transfer efficiency, non-contact welding, solder can be solder paste or tin wire, especially suitable for welding solder joints in small spaces or small solder joints with low power, saving energy . It is very suitable for products with particularly high quality requirements and products that must use local heating. It meets the electronic needs of precision and automatic welding, such as reflow soldering of high-density lead surface mount devices, and reflow soldering of heat-sensitive and static-sensitive devices. , Selective reflow soldering, BGA outer lead bump production, Flip chip on-chip bump production, BGA bump rework, TAB device package lead connection, camera module, VCM voice coil motor, CCM, FPC, Laser soldering has become more and more popular for connectors, antennas, sensors, inductors, hard disk heads, speakers, speakers, optical communication components, heat-sensitive components, photosensitive components and other products that are difficult to solder by traditional methods.