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Melting point 300℃ high temperature solder paste characteristics

Melting point 300℃ high temperature solder paste characteristics

Aug 15, 2022

08-152022

1. Excellent performance of solder paste



The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.



2. How to use solder paste



The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.


1. Excellent performance of solder paste



The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.



2. How to use solder paste



The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.



3. How to store solder paste



Solder paste should be avoided from being exposed to the air for a long time. It can be stored in the refrigerator at 0℃-10℃. Please take it out of the refrigerator and return to temperature before use. It can be stored in the refrigerator for about half a year without deterioration.



1. Excellent performance of solder paste



The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.



2. How to use solder paste



The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.



3. How to store solder paste



Solder paste should be avoided from being exposed to the air for a long time. It can be stored in the refrigerator at 0℃-10℃. Please take it out of the refrigerator and return to temperature before use. It can be stored in the refrigerator for about half a year without deterioration.
Use method and precautions of solder paste

Use method and precautions of solder paste

Aug 12, 2022

08-122022

For many newly established SMT beginners or production line managers, the straight through rate of SMT production line is the top priority, 60%-70% of the defective rate is generated in the welding process. Most of the reasons are related to the improper use and storage of solder paste, how to store and use, and what problems should be paid attention to in the process of use. Analyze the problems and hope to help electronic foundry or SMT chip processing department to better understand the use of solder paste.
1. How to store the tin paste
The paste should be sealed and stored in the refrigerator at 2-10 degrees Celsius. Xinfu Jinxi paste is generally valid for 3-6 months. Use the queuing mechanism, using the first in first out principle.
How to use solder paste
1. The regeneration
After the solder paste is removed from the refrigerator, condensation will occur immediately on the surface of the solder paste bottle due to the low storage temperature, and the water vapor in the air will also condense. Do not open the cap immediately after taking it out of the tin can. The paste must be placed at room temperature for 2-4 hours to return the temperature to the natural ambient temperature (25±3C). It is strictly prohibited to use external heating device to reheat the solder paste quickly.
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Catherine Fannie Avril
Chtherine Fannie Avril