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Tin Ingot
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Tin Ingot
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Tin Bar
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Industry News
How to maintain the solder paste when using it?
Jan 11, 2023
01-11
2023
We all know that solder paste is a viscous paste-like object composed of tin and other metal substances, fluxes, and additives. Its main function is to solder components to the corresponding positions on the PCB board. How to maintain the solder paste during use?
Why do soldering iron lead-free soldering process choose tin-copper lead-free tin wire?
Jan 10, 2023
01-10
2023
There are many kinds of lead-free tin wires that can be used for lead-free soldering with soldering irons, such as tin-copper lead-free tin wires, 3.0 silver lead-free tin wires (305), 0.3 silver lead-free tin wires (0307), etc. Which tin wire to choose? Wire is determined by many factors, such as: the requirements of the soldered product, precision, welding effect, cost control, etc., but today many electronics manufacturers choose tin-copper lead-free tin wire. The reasons are summarized as follows:
Tin Bar Soldering Guidelines and Precautions
Jan 10, 2023
01-10
2023
1. Working temperature:
Sn63/Pb37 lead-tin bar suggested working temperature: 255±10℃.
Suggested operating temperature for lead-free tin bars: 265±10°C.
2. Removal of scum in wave soldering
What are the industrial uses of solder paste?
Jan 09, 2023
01-09
2023
The solder paste itself is also a viscous shape that is uniformly combined with uniform solder alloy powder and reliable flux, and can form an alloy material connection during soldering. This substance is very suitable for the safe and reliable welding of automatic production of surface mount. It is a high-tech product of the modern electronics industry. Let's discuss it together with the following solder paste manufacturers:
What should I do if there is a sharp and continuous welding during tin wire welding
Jan 09, 2023
01-09
2023
Why does the tin wire have the phenomenon of sharp and continuous welding? In many cases, it is because there is moisture in the through hole of the PCB board. When soldering, the moisture is heated and turned into water vapor. Regular tin balls.
How to quantify the impact of solder paste voiding on solder joint performance?
Jan 06, 2023
01-06
2023
Voiding is a common problem when soldering with lead-free solder paste. Spacing between grains of lead-free solder paste can also cause voids. In addition, due to the inconsistent diffusion rate of metal elements, vacancies are usually left in the intermetallic compound body, and the vacancies will form cavities after continuous accumulation. The presence of voids results in compromised electrical and thermal properties.
The use and characteristics of lead-free solder bar and solder bar
Jan 06, 2023
01-06
2023
1. Standard solder bar: the standard is Sn63/Pb37, deformation seam, steel grid plate Sn60/Pb40 solder bar. Usually it is mainly used for wave soldering and hot dip soldering, and the working temperature is 220°C-260°C. It has the following advantages:
How to deal with the phenomenon of lead-free tin wire splashing
Jan 05, 2023
01-05
2023
Thermal shock at high temperature is one of the causes of flux and solder ball splashing, so how to alleviate this phenomenon? In order to prevent the splashing of lead-free tin wire, although there is a method of sending tin wire into the V-shaped groove , but the tin wire will harden rapidly when using lead-free tin wire, so it cannot be called perfect.
Quality analysis of tin wire
Jan 05, 2023
01-05
2023
1. Specifications for alloy composition of tin wire:
Provide alloy composition for lead-free alloys by using atomic spectrometer
2. Quality and performance analysis of tin wire solder joints:
The very necessary inspection item after lead-free assembly is appearance inspection, which is used as the inspection standard for assembly quality according to the standards formulated by the International Printed Circuit Board Association.
Cause analysis of excessive tin dipping and sharpening of tin bar solder joints
Jan 04, 2023
01-04
2023
Too much tin on the tin bar solder joint does not help the flow of current. However, it has an adverse effect on the strength of the solder joints of the tin bar. The reason for this is that the welding angle between the substrate and the solder bar is improperly adjusted. The angle should be adjusted to 45 degrees, which can make the molten solder bar separate from the line.
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