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Home > Industry News
Frequently Asked Questions about High Temperature Solder Bars

Frequently Asked Questions about High Temperature Solder Bars

Aug 31, 2022

08-312022

In the process of welding with high-temperature solder bars, there will always be various problems of poor welding, such as problems with solder joints, problems with drawing tips, problems with Qiaolian, etc. So what are the reasons for these problems? Let's take a look at the reasons for the incomplete solder joints.
How big is the solder wire diameter?

How big is the solder wire diameter?

Aug 31, 2022

08-312022

Solder wire is an indispensable electronic accessory in electronic products. In the previous article, we have talked about the classification and classification of solder wire. The actual operation process of solder wire includes manual welding and automatic welding with the help of machines. It will be easy to choose a solder wire with a large wire diameter:
Answers to questions related to tin points when soldering lead-free tin wires

Answers to questions related to tin points when soldering lead-free tin wires

Aug 30, 2022

08-302022

Lead-free tin wire is a tin wire that meets environmental protection standards. In fact, there are standards in the industry for what effect the tin point achieves during the soldering process. Below we summarize the judgment standards and related issues for soldering tin points as follows:
Solder wire manual soldering iron soldering operation guide

Solder wire manual soldering iron soldering operation guide

Aug 30, 2022

08-302022

The temperature of the iron head is 150℃ on the basis of the melting point temperature of the solder. The temperature of the iron head of the lead solder wire can generally be set as 330℃, and the setting temperature of the iron head of the lead-free solder wire is generally expected to be between 350 degrees and 370 degrees.
In the process of using tin strip, too much tin slag is produced, how to deal with it?

In the process of using tin strip, too much tin slag is produced, how to deal with it?

Aug 23, 2022

08-232022

In the process of wave soldering, tin bars will produce tin dross, but sometimes too much tin dross is found. At this time, we should pay attention to whether there is any problem.

      First of all, we should distinguish whether the tin slag that appears is normal tin slag. Generally, the tin slag in the form of black powder is normal, while the tin slag in the form of tofu slag is abnormal. In view of this situation, we analyze the reasons for the following points:

      1. In this case, the main reason is because of the problem of the wave furnace of the wave soldering equipment. At present, the design of many wave furnaces is not ideal. The wave peak is very high, the distance between the peaks is too wide, and the distance between the double wave furnaces is too close. There are also rotary pumps used in the equipment, which are all possible causes of tin dross. If the wave peak is too high, the deviation of the temperature reduction may become larger during the process of the solder falling from the peak to the peak, and the solder will be mixed with air, causing oxidation or semi-dissolving of the solder, resulting in the generation of tin dross. If the preventive measures of the rotary pump are not done well, the tin slag will be continuously pressed into the furnace, and the chain reaction of the loop will aggravate the generation of the problem tin slag.

      2. The temperature is too low, and the temperature control of wave soldering is relatively low, generally 280 °C ± 5 °C, and this temperature is the minimum temperature required in the solder melting process, and the temperature is lower than the tin can not achieve good melting , indirectly causing excessive tin dross.

      3. Missed the most suitable tinning time. In the wave soldering process, the time of adding tin strips is also very critical. The most suitable time is to always keep the distance between the tin surface and the peak as short as possible.

      4. The tin slag in the furnace is not cleaned in time, and whether the tin slag is regularly cleaned is also one of the reasons for the problem. Too much tin slag in the furnace will cause the solder falling from the peak to not fall into the furnace as soon as possible, but Staying on the dross leads to uneven heating, thus causing excessive dross.

      5. Is there a regular cleaning of the wave furnace? If the wave furnace is not cleaned for a long time, the impurity content in the furnace will be high, which will also lead to excessive tin slag.
Chemical composition of lead-free solder paste

Chemical composition of lead-free solder paste

Aug 15, 2022

08-152022

The composition of lead-free solder paste is very complex, usually made by mixing metal solder powder, flux and other chemical additives evenly. Through a series of operations by the solder paste manufacturer, a milky mixture will be formed later. Solder paste will have a certain viscosity at room temperature. During the SMT patching process of the circuit board, the electronic components can be firmly adhered to a specific position. The factory does not collapse after the solder paste is patched during the SMT patching process. Stabilize electronic components.

        During the secondary soldering process of reflow soldering, with the continuous volatilization of some solvents and additives in the solder paste, the solder paste will collapse slightly. Melted to form a strong metallurgical bond between the circuit board and the electronic components, thereby permanently connecting the soldered electronic components and the circuit board.

        There is flux in the composition of lead-free solder paste. This material can not only remove metal oxides from circuit boards and electronic components, but also adhere to the surface of electronic components and circuit boards after melting, thereby preventing The two are oxidized twice, and the flux component in the lead-free solder paste forms a liquid after melting, and can also achieve the effect of assisting heat conduction. The components in the flux can promote the melting of the metal components in the solder paste and wet the metal surfaces waiting to be soldered on circuit boards and electronic components. At the same time, it can also reduce the tension on the surface of the solder paste. The flux components in the lead-free solder paste not only play the above important roles, but also can be used as a carrier of metal alloy powder in the production process of Xinfujin solder paste manufacturers.

        The main components of lead-free solder paste can be mainly divided into the above-mentioned: activator, thixotropic agent, resin and solvent, etc. Among them, the flux is also the activator. The choice of flux is very important, usually a good one Lead-free solder paste should have good wetting properties, thermal collapse resistance, and good bonding properties, which are mainly reflected by the composition of the flux.
Solder paste quality inspection steps:

Solder paste quality inspection steps:

Aug 12, 2022

08-122022

1. For solder powder detection, the particle size of tin powder can be measured with a high magnification microscope to check the distribution of tin powder particles. It is relatively high, which proves that the quality of this solder paste solder powder is relatively good, and it will not affect the quality of SMD printing on the stencil.

2. Use atomic absorption spectrometer to measure the chemical elements in the solder paste. Usually the detection items are the content of harmful metal elements such as lead, mercury and cadmium. If the solder paste is a halogen-free solder paste, it is also necessary to check the halogen in the solder paste in advance. Does the content meet the standard?

3. In the viscosity test, the viscosity of the solder paste will greatly affect the printability of the solder paste on the screen. If the viscosity of a solder paste is large, the slump performance will be greatly improved, but the printability will be poor. It may affect the release effect, and the solder paste may stick to the stainless steel mesh, resulting in poor printing.

4. Stencil printability test, the use of smt stencil to print solder paste is an indispensable step in the patch welding process, so it is essential for a solder paste to have good printability, so the IQ C department can Take a small amount of solder paste and perform a printability test to verify that the stencil printability of this solder paste is good.

5. Test the solderability of the solder hook. The sweatability of the solder paste can be divided into wettability and solderability. This function is mainly to test whether the solder paste will dry out. If it does not dry out, the connection strength after soldering meets the requirements. requirements? This step of checking whether it is good or bad can be tested using discarded circuit boards and electronic components that have been disassembled.

6. Whether the solder joints are full and shiny, this detection step can be done by pasting the solder paste on the glass and reflow soldering. After the soldering is completed, it can be observed with the naked eye to see whether the solder joints are shiny. It can also be seen from the glass whether there is a lot of residue after solder paste soldering?

        Through the above steps, we can basically judge the quality of a solder paste intuitively or from data, whether the solder paste is lead, lead-free or silver-containing, an experienced electronics factory can pass each The data of each test is summarized and organized into a table, and the quality of the solder paste is verified by analyzing the results of each test.
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Catherine Fannie Avril
Chtherine Fannie Avril