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Home > Industry News
Precautions for lead-free tin bars in soldering process and production operations

Precautions for lead-free tin bars in soldering process and production operations

Oct 25, 2022

10-252022

We all know that lead-free tin bars often generate a lot of smoke during welding, and the generated smoke will have a certain impact on human health. The welding environment of the solder bar must have a good ventilation system and a system to purify the air. If not, at least each solder bar soldering station should be equipped with a small smoking fan.
What are the uses and development of solder paste

What are the uses and development of solder paste

Oct 25, 2022

10-252022

The main active ingredient in solder paste is rosin, in addition to active agent, thixotropic agent and solvent. Rosin will be decomposed by tin at around 260 °C (some good rosin can reach 400 °C), so the temperature of the tin bath should not be too high. In solder paste, it is an indispensable auxiliary material, and its role is extremely important.
Advantages of Lead-Free No-Clean Solder Pastes

Advantages of Lead-Free No-Clean Solder Pastes

Oct 24, 2022

10-242022

With the development of society and the changes of the times, lead-free no-clean solder paste has been applied to all walks of life, and the requirements for environmental protection are getting higher and higher, so what are the advantages of lead-free no-clean solder paste compared to traditional lead-free solder paste? What about the advantage?
What are the characteristics and purchasing skills of special-shaped solder wire

What are the characteristics and purchasing skills of special-shaped solder wire

Oct 24, 2022

10-242022

For special-shaped solder wire, use a thermometer to measure the temperature of the soldering iron tip before welding. The soldering process of lead-free tin wire should be as short as possible to avoid damage to the circuit board; and the flux should be able to solder all types of circuit boards and components.
Principles and specifications for the use of lead-free solder paste

Principles and specifications for the use of lead-free solder paste

Oct 21, 2022

10-212022

Principles of use of lead-free solder paste:
1. The use of solder paste must give priority to the use of recycled solder paste and can only be used once, and then scrap the rest.
2. The principle of using solder paste: first use first (the remaining solder paste must be mixed with new solder paste when using the first time, and the mixing ratio of old and new solder paste should be at least 1:1 (the proportion of new solder paste is better, and it is the same) model same batch).
Causes and solutions of tin wire fried tin

Causes and solutions of tin wire fried tin

Oct 21, 2022

10-212022

As we all know, the use effect of tin wire is very important, the experience of employees is very important, and everyone is concerned about safety issues. Today, we will talk about the reasons and solutions for tin wire fried tin.
The main reason for fried tin is that the viscosity of the flux is too low to inhibit the evaporation rate of the solvent. The solvent in the flux dipped on the PCB volatilizes, cooling the board surface, and the air in contact with the PCB is condensed to form a mist that condenses on the board surface.
Setting of reflow profile of lead-free solder paste

Setting of reflow profile of lead-free solder paste

Oct 20, 2022

10-202022

The setting of the lead-free solder paste furnace temperature curve is very important, and everyone must be careful. Only by mastering the method of how to set the furnace temperature curve of lead-free solder paste can we ensure that the lead-free solder paste is in the best state.
Attention should be paid to the temperature setting of the solder paste furnace:
What is the difference between lead-free solder balls and lead-free solder balls

What is the difference between lead-free solder balls and lead-free solder balls

Oct 20, 2022

10-202022

People often confuse lead-free solder balls with lead-free solder balls, but they are not. The difference between lead-free solder balls and lead-free solder balls from solder ball manufacturers is the main difference in the mechanism of production. In addition, in terms of appearance and volume, the outer shape of lead-free solder balls is larger than that of lead-free solder balls, usually greater than 5mil in diameter. From the position of appearance, the lead-free solder balls are mainly concentrated in the middle of the chip component and the lower sides of the component body, while the lead-free solder balls are anywhere in the flux residue.
Lead-free low temperature solder wire

Lead-free low temperature solder wire

Oct 19, 2022

10-192022

Lead-free low-temperature solder wire is a low-melting lead-free environmentally friendly solder wire divided according to the melting point temperature of the solder wire. Refined with professional equipment and special craftsmanship. The proportion of the alloy is reasonable, and the flux is made of high-quality modified resin, organic activator and various additives, so that the low-temperature lead-free solder wire also has its special welding performance and application in the lead-free process.
Analysis of physical properties of tin-bismuth alloy

Analysis of physical properties of tin-bismuth alloy

Oct 19, 2022

10-192022

Bismuth is a small metal that has only attracted attention in recent years. Its element is bismuth ingot, but its element is very small, most of which are in the form of bismuth oxide, and some bismuth alloys appear. Tin-bismuth alloy is one of them.
Tin-bismuth alloy is an environmentally friendly alloy. At room temperature, it is solid and silver-white, with a melting point of 138 degrees and a solid-liquid volume shrinkage rate of 0.051%, with strong permeability.
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Catherine Fannie Avril
Chtherine Fannie Avril