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The status of high temperature solder wire
Oct 17, 2022
10-17
2022
Where is the position of high-temperature solder wire: The solder wire used for manual electronic component welding is composed of tin alloy and additives. During electronic welding, the solder wire is matched with the electric soldering iron, and the high-quality electric soldering iron provides stable and continuous melting heat , The solder wire is added to the surface and gap of the electronic original device as a filler metal, and the fixed electronic original device becomes the main component of welding.
The use of high temperature solder wire
Oct 17, 2022
10-17
2022
The tin wire will melt after high temperature, soldering the components and the circuit board together. Tin is a conductive metal. The function is to solder the components to the circuit board. The function of the circuit board is to replace the wire connection of the earliest era, so that these electronic components that need to be combined and connected are concentrated together. The birth of the printed circuit board is a cross-generational product.
Analysis of the causes of low residues in solder paste?
Oct 14, 2022
10-14
2022
For a reflow process without cleaning, low residues are often required for cosmetic or functional effects, examples of functional requirements include "probing test overlays with solder flux residues tested in circuits and Make electrical contact between the plug-in contact and the surfacing layer or between the plug-in contact and the through hole near the reflow solder joint”.
What is the reason for the bad balling of solder paste?
Oct 14, 2022
10-14
2022
BGA balling often encounters defects such as under-soldering, misalignment of solder balls, missing solder balls and insufficient solder volume, which are usually caused by insufficient fixing force or insufficient self-centering force to the ball during reflow. Insufficient holding force can be caused by low viscosity, high barrier thickness or high outgassing speed; while insufficient self-setting force is generally caused by weak solder flux activity or too low solder volume.
How to understand the characteristics of high temperature solder paste?
Oct 14, 2022
10-14
2022
1. High temperature solder paste printing has good rolling and tinning properties, and can also complete good printing for pads as low as 0.3mm pitch;
High temperature solder paste
2. During continuous printing, its viscosity changes very little, the stencil has a long operational life, it will not dry out for more than 8 hours, and it still maintains a good printing effect;
Excellent properties of lead-free solder paste
Oct 12, 2022
10-12
2022
(1) The solder paste co-current peak temperature is low and the reflow time is short. Excessive reflow peak temperature or long reflow time will cause different degrees of damage to components and PCBs, and also increase energy consumption. Therefore, under the premise of ensuring the soldering quality of solder paste, it is of great significance to reduce the peak reflow temperature or shorten the reflow time for the reliability of electronic products. By adjusting the reflow process, the peak temperature of our lead-free solder paste can be reduced to 230°C, and good solder joint quality can be obtained at the same time.
Solder wire specification classification
Oct 12, 2022
10-12
2022
According to different situations, solder wire has several classification methods:
Classified by metal alloy material: can be divided into tin-lead alloy solder wire, pure tin solder wire, tin-copper alloy solder wire, tin-silver-copper alloy solder wire, tin-bismuth alloy solder wire, tin-nickel alloy solder wire and special tin-containing alloy material of solder wire;
What should I do if there is a tin bead phenomenon when the solder wire is used?
Oct 09, 2022
10-09
2022
When the solder wire is used for soldering, the solder meets the high-temperature soldering iron at the pad, melts due to the high temperature, and the liquid tin spreads rapidly with the help of the flux to be firmly connected to the pad. At this time, there may be two situations that lead to the phenomenon of poor tin frying under the welding process. The following is an introduction to the phenomenon of solder balls appearing when the solder wire is used:
Comparison of lead-free solder paste and leaded solder paste
Oct 09, 2022
10-09
2022
Solder paste is mainly a paste-like mixture composed of solder powder and flux. It is mainly used in the SMT processing industry to solder electronic components such as resistors, capacitors, and ICs on PCB boards. Solder paste is divided into lead-free solder paste and leaded solder paste. Lead-free solder paste is an important material for electronic component soldering. Lead-free solder paste refers to the requirement of lead content less than 1000ppm (<0.1%) to comply with environmental protection ROHS Standard; leaded solder paste literally means solder paste containing lead. These two solder pastes are very different. Today we will organize and analyze them as follows:
How to choose solder paste and what to pay attention to when choosing?
Oct 08, 2022
10-08
2022
In the last issue, we focused on the knowledge of the classification method of solder paste, so how should we choose solder paste in practical applications? The good selection of solder paste will greatly improve the production process and efficiency, and the quality of solder paste will also Regarding the quality of SMT processed products, how to choose solder paste can refer to the following points according to the performance and usage requirements of solder paste:
1. The activity of the solder paste can be determined according to the cleanliness of the surface of the printed board. At present, the RMA grade is generally used, and the RA grade is used if necessary.
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Catherine
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