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Home > Industry News
The difference between rosin, flux, flux paste and solder paste and their respective functions

The difference between rosin, flux, flux paste and solder paste and their respective functions

Sep 30, 2022

09-302022

In SMT processing, rosin, flux, flux paste, and solder paste are all relatively common welding materials. With the continuous development of technology, people process substances with different components into a more useful material. Therefore, some People often confuse rosin, flux, flux paste, and solder paste.
recautions for storage of lead-free solder paste

recautions for storage of lead-free solder paste

Sep 29, 2022

09-292022

The preservation of lead-free solder paste should be stored in a sealed form in a refrigerator with constant temperature and humidity (note that it is refrigerated instead of freezing). There are special freezers for lead-free solder paste on the market, and the temperature is 2℃～8℃ If the temperature is too high, the alloy powder in the lead-free solder paste does not chemically react with the flux, which will reduce the viscosity and activity and affect the performance of the lead-containing solder paste; if the temperature is too low , it will cause crystallization and deteriorate the shape of the solder paste.
What kind of solder bars should I use for wave soldering?

What kind of solder bars should I use for wave soldering?

Sep 29, 2022

09-292022

When electronic manufacturers buy new wave soldering, whether it is a lead-free process or a lead-containing process, they must use tin bars with relatively high purity, which is related to the welding quality of future products and the manufacturer's control of tin costs. Because the wave soldering furnace will corrode the copper and aluminum elements fused into the components and the wave soldering fixture in the tin furnace during the long-term use. In this way, the proportion of these impurities in the tin furnace will become larger and larger, so that the viscosity of the tin in the wave soldering furnace will become larger and larger.
Selection basis and management of solder paste

Selection basis and management of solder paste

Sep 28, 2022

09-282022

Solder Paste Selection Basis
1. High-reliability products require high-quality solder paste, depending on the product's value and use.
2. The alloy composition of the solder paste is selected according to the assembly process of the product, the printed board and the components.
(1) Commonly used solder paste alloy components: Sn63Pb37 and Sn62Pb36Ag2.
(2) Components with poor solderability of gold or silver thick film terminals and pins should select silver-containing solder paste.
The price difference of lead-free solder wire with different components

The price difference of lead-free solder wire with different components

Sep 28, 2022

09-282022

The price of tin wire is mainly determined by its alloy composition, technical difficulty and production difficulty. The more commonly used lead-free tin wires in the market include silver-containing lead-free tin wires and conventional lead-free tin wires. Silver is a precious metal, so the higher the silver content of the tin wire, the higher the price. The composition of conventional lead-free tin wire is Sn99.3%Cu0.7%, which is the lowest price lead-free tin wire. In terms of technical difficulty, because the market is very mature, it is not very difficult.
Overview and requirements of solder paste

Overview and requirements of solder paste

Sep 27, 2022

09-272022

Solder paste is also called solder paste. For the introduction of solder paste, solder paste is divided into unleaded solder paste and leaded solder paste. The solder paste produced by double Chile solder paste manufacturers is a 500-gram can, and the lead-free environmental protection is a green plastic can. Leaded for white plastic cans
How to detect solder bar degree

How to detect solder bar degree

Sep 27, 2022

09-272022

There are many kinds of solder bars, only lead solder bars have more than ten kinds from 15-63 degrees, but the outer packaging is marked with 63/37 molds. It is difficult for non-professional personnel to see the difference between them. Below we will introduce the inspection method of solder strip degree in detail:
1. Identify from appearance
The solder bar has two sides, and the front usually has some company, parameters and other product logos. The backside of the solder bar below 45 degrees usually has a dim light. The surface and back of the 63/37 solder bar have a glossy surface with a bluish-white color below 45 degrees, which can be easily identified based on this phenomenon.
What are the regulations for the use of solder paste?

What are the regulations for the use of solder paste?

Sep 26, 2022

09-262022

Rules for the use of solder paste:
1. Take the solder paste out of the refrigerator, put a "control use label", and fill in the "thawing start time and signature". The solder paste must be completely thawed before opening the lid for use. The thawing time is 6 to 12 hours.
2. Before using the solder paste that has been opened, you must first understand the opening time and confirm whether it is within the validity period of use.
Analysis of lead-free environmental protection tin bar welding

Analysis of lead-free environmental protection tin bar welding

Sep 26, 2022

09-262022

We often encounter many problems in welding. Let's talk about the following reasons why the solder joints do not shine after the lead-free environmental protection tin bars are welded:
1. The tin content of the lead-free environmental protection tin bar determines the brightness of the tin point. The surface of the tin and lead-tin metal elements, which are part of the tin bar, has a bluish white luster, while the surface of the lead metal element is gray. The higher the tin, the brighter the tin point. On the contrary, the higher the lead content of the solder bar, the duller the tin point.
Reasons for poor scratching of lead-free solder paste

Reasons for poor scratching of lead-free solder paste

Sep 23, 2022

09-232022

The scraping pit is in the process of solder paste printing, the scraper moves back and forth continuously, the scraper scrapes the lead-free solder paste at the opening of the stencil to form poor scraping, and the solder paste at the opening of the stencil is scraped away. This will lead to less tin on the circuit board. After reflow soldering, the solder joints with less tin have insufficient welding strength and lack the proper support for electronic components, resulting in welding defects. The occurrence of scraped pits and less tin can first rule out the reasons for the product quality of lead-free solder paste manufacturers. Usually, poor scraping pits are closely related to the processing process of SMT manufacturers. This defect is found in the actual process of bad production lines. It has a greater relationship with the solder paste printing stencil and the squeegee.
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Catherine Fannie Avril
Chtherine Fannie Avril