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News
What are the factors to be considered in the selection criteria of leaded solder paste?
Jan 11, 2023
01-11
2023
The selection criteria of leaded solder paste mainly start from the following factors:
1. Alloy composition: In general, Sn63/Pb37 solder alloy composition can meet most welding requirements; for welding and QFN process of Ag or Pd coated devices, generally choose alloy composition Parts are Sn63/Pb35/Ag2 solder paste; for pcb soldering of devices that are not resistant to thermal shock, choose Bi-containing solder powder.
Why do soldering iron lead-free soldering process choose tin-copper lead-free tin wire?
Jan 10, 2023
01-10
2023
There are many kinds of lead-free tin wires that can be used for lead-free soldering with soldering irons, such as tin-copper lead-free tin wires, 3.0 silver lead-free tin wires (305), 0.3 silver lead-free tin wires (0307), etc. Which tin wire to choose? Wire is determined by many factors, such as: the requirements of the soldered product, precision, welding effect, cost control, etc., but today many electronics manufacturers choose tin-copper lead-free tin wire. The reasons are summarized as follows:
The reason why the tin wire turns yellow during the soldering process
Jan 10, 2023
01-10
2023
In the welding of electronic circuit boards, the surface of the tin point after tin wire welding is rough, bridged, tin beads, board surface is dirty, and the circuit board is short-circuited. The main materials of electronic tin wire are tin wire, tin bar, auxiliary Flux, PCB board surface and electronic components are several parts, so which part has problems will eventually affect the quality of tin wire.
Tin Bar Soldering Guidelines and Precautions
Jan 10, 2023
01-10
2023
1. Working temperature:
Sn63/Pb37 lead-tin bar suggested working temperature: 255±10℃.
Suggested operating temperature for lead-free tin bars: 265±10°C.
2. Removal of scum in wave soldering
Reasons for missing parts in low temperature tin wire welding
Jan 10, 2023
01-10
2023
The problem of low-temperature tin wire dropping is a problem that is usually encountered when using low-temperature tin wire products. The main reason is that its tin wire metal composition is tin-bismuth alloy. More bismuth in the solder paste can lower the melting point, but the same solder joints are very brittle, making it easy to drop parts when soldering.
What are the industrial uses of solder paste?
Jan 09, 2023
01-09
2023
The solder paste itself is also a viscous shape that is uniformly combined with uniform solder alloy powder and reliable flux, and can form an alloy material connection during soldering. This substance is very suitable for the safe and reliable welding of automatic production of surface mount. It is a high-tech product of the modern electronics industry. Let's discuss it together with the following solder paste manufacturers:
What kind of soldering is suitable for tin wire?
Jan 09, 2023
01-09
2023
Tin wire is a soldering material composed of tin alloy and flux. Lead solder alloy is divided into tin-lead and lead flux. Environmentally friendly solder is composed of tin-copper alloy and lead-free flux. The main function of tin wire is to fill, repair or connect the main soldering material between two electronic components. Can all materials be wire soldered?
What should I do if there is a sharp and continuous welding during tin wire welding
Jan 09, 2023
01-09
2023
Why does the tin wire have the phenomenon of sharp and continuous welding? In many cases, it is because there is moisture in the through hole of the PCB board. When soldering, the moisture is heated and turned into water vapor. Regular tin balls.
What does tin wire no-cleaning mean?
Jan 09, 2023
01-09
2023
In the entire production process of the electronics industry in the past, the traditional tin wire welding process often has disadvantages such as large residue, high corrosion, and poor appearance. After the tin wire is soldered, it needs to be cleaned with board washing water. In the cleaning process, due to the assembly of fine gaps and high-density components, it will cause cleaning difficulties, that is, increase cleaning costs and waste man-hours.
How to quantify the impact of solder paste voiding on solder joint performance?
Jan 06, 2023
01-06
2023
Voiding is a common problem when soldering with lead-free solder paste. Spacing between grains of lead-free solder paste can also cause voids. In addition, due to the inconsistent diffusion rate of metal elements, vacancies are usually left in the intermetallic compound body, and the vacancies will form cavities after continuous accumulation. The presence of voids results in compromised electrical and thermal properties.
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