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News
Dyeing of SMT solder joints and brand solder wire penetration test
Nov 16, 2022
11-16
2022
With the rapid development of SMT technology and some brands of solder wire and high-seal packaging technology for components, it is difficult to find the hidden solder joint defects of many brands of solder wire with intuitive methods. The quality and reliability of solder joints must be adapted to this test technology
Lead-free solder wire temperature requirements
Nov 15, 2022
11-15
2022
The temperature requirement of lead-free solder wire is higher than that of lead-free solder wire. The appearance of wire solder joints is relatively rough, there are many pores in the solder joints, and the requirements for wetting angle are relatively large. Without half-moon-shaped lead-free solder wire, the requirements for additives are relatively high. It is necessary to increase the activity of additives and increase the requirements for activation temperature. .
What is the relationship between solder wire color and purity?
Nov 15, 2022
11-15
2022
The quality of solder wire largely determines the soldering effect, so it is very important to choose a good quality solder wire.
I believe everyone has heard that the quality of solder wire can be judged by the glossiness of solder joints. Comparing the whitening degree of solder joints, you can know the proportion of lead content in solder wire, so as to judge the quality of solder wire.
The use of solder wire
Nov 15, 2022
11-15
2022
1. Rosin solder wire
It is suitable for electronic repair welding of electronics and related components. The residue after welding has high impedance, no leakage, and can pass the high voltage test.
How many quality problems exist in tin wire?
Nov 15, 2022
11-15
2022
For the soldering tin industry, the melting point of solder wire without lead must be increased by at least 20-45°C according to the difference in composition. In this way, the temperature setting of the soldering iron tip must also increase accordingly. As the temperature increases, the evaporation rate of the flux also increases, and the flux is the key factor that determines the metal activity (fluidity) after the solder wire is melted.
Production process of tin products such as lead-free solder balls
Nov 14, 2022
11-14
2022
Tin products are generally composed of raw materials such as tin ingots, lead ingots, and other metal raw materials. They are dissolved at high temperature and mixed with various metals in different proportions in the boiler to make special tin products required by customers.
Process characteristics of lead-free environmentally friendly solder wire
Nov 14, 2022
11-14
2022
Lead-free environmentally friendly solder wire uses lead-free solder to replace traditional tin-lead eutectic solder, which makes the process of lead-free environmentally friendly solder wire have significantly different characteristics. First, the temperature of the soldering process increases significantly, and the process window shrinks sharply.
What are the product features in the application of leaded solder paste?
Nov 14, 2022
11-14
2022
The leaded solder paste is a mixture of flux components and alloy components. The main components of the alloy are tin and lead, so it is called leaded solder paste. In addition to these, solder paste alloys will have trace amounts of impurity metal elements (such as iron, zinc, copper, aluminum, silver, mercury, arsenic, etc.)
leaded solder paste
High temperature solder bar solder joint blow hole failure
Nov 14, 2022
11-14
2022
During the wave soldering process, the gases generated inside the solder joints and through holes of the high temperature solder bar will escape to the outside. When the solder on the top layer of the solder joint no longer provides an escape channel for the released or captured gas, part of the gas inside the solder joint continues to expand and escapes from the bottom to form a blow hole, while the unescaped gas is wrapped in the solidification voids are formed inside the solder. During the soldering process, the gas generated inside the solder joint of the high temperature solder bar is mainly caused by the volatilization of the flux and the release of moisture.
Portable Solder Wire Drop Test
Nov 11, 2022
11-11
2022
The portable solder wire drop test is mainly to investigate the adaptability of the product to fall freely from a certain height and the integrity of the structure or solder joint after being subjected to such a drop. With the advancement of technology, electronic products are becoming more and more miniaturized, and there are more and more portable electronic products, such as mice, MP3 players and mobile phones.
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