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Definition of high temperature solder paste
Sep 19, 2022
09-19
2022
The production of solder paste will be designed according to different operating temperatures. We all know that the melting point of pure metal tin is about 230 ℃, and the melting point of alloy is that the mixture of two or more metals will be lower than the melting point of single metal. According to the type of two metal alloys and their content in the alloy, their melting points are also different. The internal solder powder is composed of different alloys.
The solution for the spots and residues on the surface of the tin bar
Sep 19, 2022
09-19
2022
The basic reason for the phenomenon of flower spots and residues on the surface of the tin bar is that these trace alloy elements in the tin bar have a great influence on the physical and mechanical properties of the tin bar. If the amount is too large, the fatigue life and plasticity of the solder joint will be reduced, and the appropriate amount of bismuth is about 0.2~1.5%. In the systematically designed chemical composition, the designer obviously hopes that the performance of the tin bar can reach an optimal balance, such as welding performance, melting temperature, strength, plasticity and fatigue life.
Lead-free solder bar rosin usage specification and dip soldering
Sep 16, 2022
09-16
2022
Rosin is a common additive in lead-free tin bars, so rosin will not cause conduction. It is an insulator itself, but the content of the auxiliaries of lead-free solder bars contains rosin but other active substances. Lead-free solder bars Excessive metering of some active substances may cause leakage.
What are the requirements for surface mount solder paste?
Sep 16, 2022
09-16
2022
With the application of reflow soldering technology, solder paste has become an important process material in surface mount technology (SMT). Connections to pads on the board. Solder paste coating is a key process in surface assembly technology, which will directly affect the soldering quality and reliability of surface assemblies. Solder paste is required to have different properties in different processes or processes of surface assembly in PCBA processing. We have collected some information to summarize the following points:
Lead-free solder bar rosin usage specification and dip soldering
Sep 15, 2022
09-15
2022
Rosin is a common additive in lead-free tin bars, so rosin will not cause conduction. It is an insulator itself, but the content of the auxiliaries of lead-free solder bars contains rosin but other active substances. Lead-free solder bars Excessive metering of some active substances may cause leakage.
How to view the activity of solder paste?
Sep 15, 2022
09-15
2022
Active solder paste refers to solder paste with added active agent. Adding active agent to solder paste is conducive to soldering. The main activity in lead-free solder paste refers to the material added with active agent. It can assist heat conduction in the SMT welding process, remove metal oxides on circuit boards and electronic components, reduce the surface tension of the welded material, and remove impurities such as oil stains on the surface of the welded material. It can increase the welding area on electronic components and circuit boards. The addition of the active agent adds to the soldering performance of the solder paste. It is a very important component of lead-free solder paste. Whether it is producing leaded or lead-free solder paste, manufacturers will add varying amounts of active agents to it.
Introduce the key factors and precautions of special-shaped tin wire welding
Sep 14, 2022
09-14
2022
After the tin wire composition is selected, the quality of the internal flux is a key factor in determining the welding quality and welding efficiency:
When using a slightly higher tip temperature, the residue should not burn or darken in color; the flux should not splatter or smoke excessively when soldering;
How to prevent fumes from lead-free tin wires during soldering
Sep 14, 2022
09-14
2022
Lead-free tin wire is an alloy composed primarily of tin, but also contains other metals. It is mainly divided into lead and lead-free. Everyone knows that lead is a toxic metal, so lead-free is more environmentally friendly. Now more and more factories choose lead-free and environmentally friendly, and lead-tin wires are gradually being replaced. At present, the main products on the market are lead-free solder paste, lead-free solder bars, and lead-free solder wires. Leaded solder is mainly composed of tin and lead in various proportions; lead-free solder is composed of tin-copper, tin-silver-copper, etc. Since the composition of the alloy and the proportion of each composition are different, the melting point of different solders is also different.
The phenomenon and solution of the solder wire bursting during the welding process
Sep 13, 2022
09-13
2022
When the solder wire is welded, the tin wire is filled with rosin. When the temperature of the soldering iron is high, the molten solder wraps the rosin, and the rosin inside is rapidly vaporized at high temperature, and the wrapped solder is washed away, resulting in a popping sound. At the same time, some brightly colored small tin bead solid metal will pop up, which is the phenomenon of fried tin.
How to distinguish between no-clean and water-wash solder paste
Sep 13, 2022
09-13
2022
1. the use of solder paste is different
The biggest feature of no-clean solder paste is that it can be free from cleaning. After the circuit board is soldered with no-clean solder paste, it can proceed to the next step of testing and assembly without cleaning. After SMT manufacturers use solder paste for soldering, the surface of the circuit board is relatively clean, and the volatilized residue after the solder paste is melted is relatively small. The circuit board can pass the inspection of various electrical
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