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Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
Sn 99.99 Tin Ingot
Tin Bar
Lead-free Solder Bar
Tin Silver Copper Solder Bar
Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
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Sn99.95 Solder Balls
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Lead-free Solder Paste
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Halogen Free Solder Paste
Medium Temperature Solder Paste
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Industry News
What are the characteristics and purchasing skills of special-shaped solder wire
Oct 24, 2022
10-24
2022
For special-shaped solder wire, use a thermometer to measure the temperature of the soldering iron tip before welding. The soldering process of lead-free tin wire should be as short as possible to avoid damage to the circuit board; and the flux should be able to solder all types of circuit boards and components.
Principles and specifications for the use of lead-free solder paste
Oct 21, 2022
10-21
2022
Principles of use of lead-free solder paste:
1. The use of solder paste must give priority to the use of recycled solder paste and can only be used once, and then scrap the rest.
2. The principle of using solder paste: first use first (the remaining solder paste must be mixed with new solder paste when using the first time, and the mixing ratio of old and new solder paste should be at least 1:1 (the proportion of new solder paste is better, and it is the same) model same batch).
Causes and solutions of tin wire fried tin
Oct 21, 2022
10-21
2022
As we all know, the use effect of tin wire is very important, the experience of employees is very important, and everyone is concerned about safety issues. Today, we will talk about the reasons and solutions for tin wire fried tin.
The main reason for fried tin is that the viscosity of the flux is too low to inhibit the evaporation rate of the solvent. The solvent in the flux dipped on the PCB volatilizes, cooling the board surface, and the air in contact with the PCB is condensed to form a mist that condenses on the board surface.
Setting of reflow profile of lead-free solder paste
Oct 20, 2022
10-20
2022
The setting of the lead-free solder paste furnace temperature curve is very important, and everyone must be careful. Only by mastering the method of how to set the furnace temperature curve of lead-free solder paste can we ensure that the lead-free solder paste is in the best state.
Attention should be paid to the temperature setting of the solder paste furnace:
What is the difference between lead-free solder balls and lead-free solder balls
Oct 20, 2022
10-20
2022
People often confuse lead-free solder balls with lead-free solder balls, but they are not. The difference between lead-free solder balls and lead-free solder balls from solder ball manufacturers is the main difference in the mechanism of production. In addition, in terms of appearance and volume, the outer shape of lead-free solder balls is larger than that of lead-free solder balls, usually greater than 5mil in diameter. From the position of appearance, the lead-free solder balls are mainly concentrated in the middle of the chip component and the lower sides of the component body, while the lead-free solder balls are anywhere in the flux residue.
Lead-free low temperature solder wire
Oct 19, 2022
10-19
2022
Lead-free low-temperature solder wire is a low-melting lead-free environmentally friendly solder wire divided according to the melting point temperature of the solder wire. Refined with professional equipment and special craftsmanship. The proportion of the alloy is reasonable, and the flux is made of high-quality modified resin, organic activator and various additives, so that the low-temperature lead-free solder wire also has its special welding performance and application in the lead-free process.
Analysis of physical properties of tin-bismuth alloy
Oct 19, 2022
10-19
2022
Bismuth is a small metal that has only attracted attention in recent years. Its element is bismuth ingot, but its element is very small, most of which are in the form of bismuth oxide, and some bismuth alloys appear. Tin-bismuth alloy is one of them.
Tin-bismuth alloy is an environmentally friendly alloy. At room temperature, it is solid and silver-white, with a melting point of 138 degrees and a solid-liquid volume shrinkage rate of 0.051%, with strong permeability.
The status of high temperature solder wire
Oct 17, 2022
10-17
2022
Where is the position of high-temperature solder wire: The solder wire used for manual electronic component welding is composed of tin alloy and additives. During electronic welding, the solder wire is matched with the electric soldering iron, and the high-quality electric soldering iron provides stable and continuous melting heat , The solder wire is added to the surface and gap of the electronic original device as a filler metal, and the fixed electronic original device becomes the main component of welding.
The use of high temperature solder wire
Oct 17, 2022
10-17
2022
The tin wire will melt after high temperature, soldering the components and the circuit board together. Tin is a conductive metal. The function is to solder the components to the circuit board. The function of the circuit board is to replace the wire connection of the earliest era, so that these electronic components that need to be combined and connected are concentrated together. The birth of the printed circuit board is a cross-generational product.
Analysis of the causes of low residues in solder paste?
Oct 14, 2022
10-14
2022
For a reflow process without cleaning, low residues are often required for cosmetic or functional effects, examples of functional requirements include "probing test overlays with solder flux residues tested in circuits and Make electrical contact between the plug-in contact and the surfacing layer or between the plug-in contact and the through hole near the reflow solder joint”.
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