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Home > Industry News
Formation of tin wire solder joints

Formation of tin wire solder joints

Dec 01, 2022

12-012022

There are three types of tin wire welding: fusion welding, brazing and contact welding. Brazing is mainly used in the assembly of wireless point machines. Brazing refers to the technique of joining solid metals together by heating molten metals. The metal solder material that plays a role in brazing is called brazing material, that is, solder.
Discussion on fluxing of lead-free solder wire

Discussion on fluxing of lead-free solder wire

Dec 01, 2022

12-012022

In the manual soldering iron soldering of lead-free flux-cored solder wire, the temperature setting of the soldering iron tip is above 300 C. The requirements of contemporary green electronics processes pose enormous challenges to flux cored fluxes:
High temperature solder wire solder

High temperature solder wire solder

Nov 30, 2022

11-302022

High-temperature tin wire is the most convenient solder for manual soldering of circuit boards. Since most tin wires contain flux such as rosin, the use of tin wire can reduce the process and improve the efficiency of soldering operations.
How to use high temperature tin wire and precautions:
How to use the flux in solder wire?

How to use the flux in solder wire?

Nov 30, 2022

11-302022

Generally, why do we use flux in solder wire? Rosin is generally used for welding small parts, and flux is used for welding large parts. Everyone knows that rosin is used for circuit boards, and flux is used for single-piece welding. Want to know how to use flux? Everyone should first understand what flux is?
Causes and Countermeasures of Bad Cold Soldering

Causes and Countermeasures of Bad Cold Soldering

Nov 29, 2022

11-292022

If the surface of the cold solder joint is not smooth, in severe cases, the tin wire will be around the line pins and cause wrinkles or cracks. Such solder joints generally have a short service life, and they will be disconnected after a period of use, resulting in poor soldering of the circuit.
The properties and uses of tin

The properties and uses of tin

Nov 29, 2022

11-292022

The discovery and use of tin can be traced back to prehistory. The "Bronze" Age, which played a role in promoting human civilization, was marked by the use of tin-copper alloy bronze. The element symbol of tin is Sn, which belongs to group IVA in the periodic table of elements, with an atomic number of 50 and an atomic weight of 118.69. Tin is stable at 13.2~161°C, and it is silvery white, that is, white tin.
Disadvantages of Gold-Sn Alloy (Au-Sn) Solder

Disadvantages of Gold-Sn Alloy (Au-Sn) Solder

Nov 28, 2022

11-282022

The disadvantage of Au80%Sn20% solder is that it is more expensive, brittle, has a small elongation, and is not easy to process. In addition, due to the high melting point, it cannot be soldered with low melting point solder at the same time. It can only be used in situations where the chip can withstand a short-term higher than 300°C.
Application range of high temperature and low temperature solder paste

Application range of high temperature and low temperature solder paste

Nov 28, 2022

11-282022

When it comes to solder paste, I believe everyone knows what it is, but do you know about high temperature and low temperature solder paste?
The main difference between high-temperature solder paste and low-temperature solder paste is that the temperature of some chips cannot be high during the furnace, and bubbles will form when the temperature is high, but low-temperature solder paste may cause problems after the temperature is generated (higher) and some vibration pins , High-temperature solder paste is generally used for SMT components with high heat generation.
How to use BGA chip laser solder balls for tin planting

How to use BGA chip laser solder balls for tin planting

Nov 25, 2022

11-252022

As mobile phones become more and more advanced, the degree of internal integration is also getting higher and higher, and almost all mobile phones now use ball grid array packaging modules, which is what we usually call BGA. This module is welded on the main board in the form of patch. BGA modules utilize the entire bottom of the package to interface with the circuit board. Instead of pin soldering, soldering is done with laser solder balls. And how is the BGA chip laser tin ball soldering process planted tin?
Classification and Application Analysis of Solder Paste Inspection Equipment

Classification and Application Analysis of Solder Paste Inspection Equipment

Nov 25, 2022

11-252022

Solder paste inspection equipment is a measurement equipment in SMT chip processing that has been introduced in the past two years. Similar to AOI. Solder Paste Inspection (SPI) is to check the height, volume, area, short circuit and offset of solder paste after solder paste printing.
At present, the main inspection methods in the field of SPI are laser inspection and fringe light inspection. Wherein the laser method is realized with a point laser. Since the point laser and CCD image acquisition must have an X, Y point-by-point mechanism, the measurement speed has not been significantly increased. In order to increase the measurement speed, the point laser is changed to a scanning line laser light.
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Catherine Fannie Avril
Chtherine Fannie Avril