USD
EUR
GBP
CAD
AUD
CHF
HKD
JPY
RUB
BRL
CLP
NOK
DKK
SEK
KRW
ILS
MXN
CNY
SAR
SGD
NZD
ARS
INR
COP
AED
Home
Products
Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
Sn 99.99 Tin Ingot
Tin Bar
Lead-free Solder Bar
Tin Silver Copper Solder Bar
Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
Tin Balls
BGA Solder Balls
Lead-free Solder Balls
Pure Tin Ball
Sn99.95 Solder Balls
Tin Wire
Tin Copper Solder Wire
No-clean Tin Wire
Silver Tin Wire
Tin-Silver-Coppe Tin Wire
Solid Tin Wire
Rosin Core Tin Wire
Low-temperature Solder Wire
High-temperature Solder Wire
Solder Paste
Lead-free Solder Paste
No Clean Flux Paste
Low Temperature Solder Paste
Halogen Free Solder Paste
Medium Temperature Solder Paste
High Temperature Solder Paste
Solder Flux
Environmentally Friendly Flux
No-Clean Flux
Tin Alloy
Tin Phosphorus Alloy
Tin Bismuth Alloy
News
Company News
Industry News
About Us
Contact Us
Inquiry
FAQ
Home
Products
Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
Sn 99.99 Tin Ingot
Tin Bar
Lead-free Solder Bar
Tin Silver Copper Solder Bar
Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
Tin Balls
BGA Solder Balls
Lead-free Solder Balls
Pure Tin Ball
Sn99.95 Solder Balls
Tin Wire
Tin Copper Solder Wire
No-clean Tin Wire
Silver Tin Wire
Tin-Silver-Coppe Tin Wire
Solid Tin Wire
Rosin Core Tin Wire
Low-temperature Solder Wire
High-temperature Solder Wire
Solder Paste
Lead-free Solder Paste
No Clean Flux Paste
Low Temperature Solder Paste
Halogen Free Solder Paste
Medium Temperature Solder Paste
High Temperature Solder Paste
Solder Flux
Environmentally Friendly Flux
No-Clean Flux
Tin Alloy
Tin Phosphorus Alloy
Tin Bismuth Alloy
News
Company News
Industry News
About Us
Contact Us
Inquiry
FAQ
News
Home
>
News
Process characteristics of lead-free environmentally friendly solder wire
Dec 16, 2022
12-16
2022
Lead-free environmentally friendly solder wire uses lead-free solder instead of traditional tin-lead eutectic solder, which makes the process of lead-free environmentally friendly solder wire have significantly different characteristics. First, the temperature of the welding process is significantly increased, and the process window is sharply reduced.
The difference between lead-free copper tin bar and pure tin bar
Dec 16, 2022
12-16
2022
The difference between lead-free copper-containing tin bars and pure tin bars can generally be distinguished from the following aspects:
1. Judging from the glossiness of the appearance: lead-free tin bars are bright yellow; leaded tin bars are bright white.
Use of wave soldering lead-free solder bar
Dec 16, 2022
12-16
2022
Inspiration and Suggestion from Corrosion Failure of PCBA Components to Wave Soldering Lead-free Solder Bars.
Due to the lack of post-soldering cleaning process, the use of no-clean flux in wave soldering lead-free solder bars has the risk of high surface ion content. If there are certain defects in the solder mask or green oil plug holes, under the action of a continuous electric field, the accumulated corrosive ions will gradually penetrate through the solder mask and corrode the copper layer, resulting in a series of defects in lead-free solder products.
Solder paste is not tinned, the more active the better?
Dec 15, 2022
12-15
2022
Recently, many people are asking, if the solder paste is not tinned, everyone will find out whether the activity of the solder paste is too low, but some people will say that the more active the better, is it easy to tin? What I can tell you is that it is not to eat, why? The following solder paste manufacturers will explain to you:
Everyone knows that there are many additives in solder paste, one of which is called activator.
Why does the solder paste need to be warmed up before patch soldering?
Dec 15, 2022
12-15
2022
With the development of society, solder paste, as an auxiliary soldering material, has become an unreliable part of many industries, so it is becoming more and more popular in society now, so everyone knows why it is necessary to warm up before patch soldering. Have you ever understood this, the following solder paste manufacturers will explain it to you:
Solder wire welding method
Dec 15, 2022
12-15
2022
Many people now know that solder wire is composed of tin alloy and additives. Different types of solder wire will produce different fluxes. The oil on the surface of the welding material will increase the welding area.
Application analysis of lead-free solder paste in pcb circuit board
Dec 15, 2022
12-15
2022
At present, many companies are using lead-free solder paste products and processes, so lead-free environmental protection solder paste is an important part of the lead-free process, and its performance is attracting more and more attention. The following is based on the product development of lead-free ring solder paste, and discusses in depth some problems caused by lead-free processing technology, such as alloy selection, printability, ultra-low temperature reflow, void level, etc.
Hotspots and Difficulties Analysis of Solder Ball Technology Development
Dec 14, 2022
12-14
2022
In order to prevent problems such as bridging of solder balls in the electronic connection process of BGA or FlipChip packaging with finer pitches, and to use the "self-alignment effect" of solder balls in the melting process, the solder balls used in BGA packaging, It has very high dimensional and shape precision requirements. In order to produce solder balls that meet the requirements of solder ball surface quality and dimensional accuracy, various technologies have been tried and some technical solutions have been used in production, but in order to obtain better production technologies, there are still quite a few domestic and foreign Research is invested in solder ball production technology.
The development and application of new solder ball technologies
Dec 14, 2022
12-14
2022
1. Wafer-solder ball lead-free
IC Interconnect announces that the company has the ability to provide lead-free wafer-solder ball services, in response to the global trend of reducing harmful substances in the environment.
Solder ball basic production technology
Dec 14, 2022
12-14
2022
The traditional production methods of solder ball particles include gas atomization method, centrifugal atomization method and shredded remelting method.
1. Gas atomization method
1
...
29
30
31
32
33
34
35
...
59
page:
Go
Catherine
Fannie
Avril
Chtherine
Fannie
Avril