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What are the advantages of tin wire reflow soldering machine technology
Dec 09, 2022
12-09
2022
1) When reflow soldering technology is used for soldering, it is not necessary to immerse the printed circuit board in the molten tin wire, but to complete the soldering task by partial heating; therefore, the components to be soldered are less thermally impacted and will not be affected by Overheating causes damage to components.
Solder paste reflow principle
Dec 09, 2022
12-09
2022
Due to the continuous miniaturization of PCB boards of electronic products, chip components appear, and the traditional solder paste soldering method can no longer meet the demand. Most of the components assembled and welded are chip capacitors, chip inductors, mount transistors and diodes.
The principle of reflow soldering and wave soldering of tin bars
Dec 09, 2022
12-09
2022
The difference between reflow soldering of tin bars and wave soldering is that reflow soldering is through SMT boards, while wave soldering is through plug-in boards. Reflow soldering is one of the three main processes in the SMT placement process. Reflow soldering is mainly used to solder PCB circuit boards that have already mounted components, and then cool the solder paste through reflow cooling to solidify the components and pads together.
Efficient use of no-clean solder flux
Dec 08, 2022
12-08
2022
What is the difference between no-clean solder flux and cleaning solder flux
1. No-clean solder flux means that the board surface is relatively clean after solder flux soldering, and the board surface is relatively clean when the requirements are not high or under normal circumstances. However, in special cases, it is still necessary to clean the board surface.
How to judge whether the solder flux is no-clean
Dec 08, 2022
12-08
2022
Qualified solder flux is not good or bad, and qualified solder flux is only suitable or not. Soldering process, equipment, PCB (circuit board) quality, component quality, solder quality (tin content), operator proficiency, etc. are different, and the selection and requirements for solder flux are also different.
What are the rigid requirements for solder paste in surface mount and assembly processes?
Dec 08, 2022
12-08
2022
With the application of reflow soldering technology, solder paste has become an important process material in surface mount technology (SMT). In the reflow soldering of surface mount components, solder paste is used to implement the leads or terminals of surface mount components. The connection of the solder pad on the board.
Soldering industry tin bar wave soldering and reflow soldering process
Dec 08, 2022
12-08
2022
Wave soldering refers to the process of spraying the molten solder bar into the solder wave required by the design through the electric pump or electromagnetic pump, so that the printed board pre-installed with components passes through the solder wave to realize the soldering end of the component or the pin and the printed circuit board.
Tin alloy lead-free solder inspection
Dec 07, 2022
12-07
2022
Tin alloys are a lead-free soldering option, however, soldering can exhibit the appearance of "whiskers" - small bumps of metal that protrude beyond the solder joint or pad. This kind of whisker can grow very long, so that the current of the two welding areas is too large, a short circuit occurs, and the equipment malfunctions. This problem can be easily found using tin alloys in-circuit test, but it can take time for tin whiskers to grow, and it can be a long-standing reliability problem.
Detection method of lead-free tin bar
Dec 07, 2022
12-07
2022
Lead-free solder bars have a high melting point and can damage components or assemblies. According to the concept of lead-free soldering, the melting point temperature of SnAgCu is increased from 183°C to nearly 217°C, and the peak temperature is as high as 260°C. After a long period of preheating, the high temperature can be properly reduced. Trim temperatures are also affected, with some components reaching up to 280°C. Components used at such higher temperatures must undergo qualification certification, and uncertified components need to be assembled manually.
Manual soldering points
Dec 07, 2022
12-07
2022
The following points are derived from the tin bar soldering mechanism and proved to be generally applicable by practical experience.
1. Master the heating time
Different heating speeds can be used for tin bar soldering, for example, if the shape of the soldering iron tip is bad, we have to extend the time to meet the temperature requirements of the tin bar when soldering large weldments with a small soldering iron. Prolonged heating times are detrimental to electronics assembly in most cases because
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Catherine
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Avril
Chtherine
Fannie
Avril
