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Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
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Tin Bar
Lead-free Solder Bar
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Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
Tin Balls
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Sn99.95 Solder Balls
Tin Wire
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Solid Tin Wire
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High-temperature Solder Wire
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Halogen Free Solder Paste
Medium Temperature Solder Paste
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Excellent properties of lead-free solder paste
Nov 30, 2022
11-30
2022
Lead-free solder paste is a kind of no-clean solder paste which is environmentally friendly and specially designed for SMT production process. Lead-free solder paste is made of special flux paste and lead-free tin powder with extremely low oxygen content, which has excellent continuous printing performance. The lead-free solder paste contains a high-reliability activator system, which makes it have very little residue after reflow soldering, has a relatively high insulation resistance, and can be dispensed with high reliability.
Causes and Countermeasures of Bad Cold Soldering
Nov 29, 2022
11-29
2022
If the surface of the cold solder joint is not smooth, in severe cases, the tin wire will be around the line pins and cause wrinkles or cracks. Such solder joints generally have a short service life, and they will be disconnected after a period of use, resulting in poor soldering of the circuit.
The brightness of the solder joints welded by solder wire is not enough, what is the reason?
Nov 29, 2022
11-29
2022
During welding, the brightness of the solder joints welded by the solder wire will be insufficient. According to theoretical common sense, the brightness of the solder joints is not good. It should be that the tin content of the solder wire is insufficient. So is the tin content of the solder wire insufficient? , In fact, the deviation of the brightness of solder joints is a relatively complicated problem, which needs to be analyzed carefully.
The properties and uses of tin
Nov 29, 2022
11-29
2022
The discovery and use of tin can be traced back to prehistory. The "Bronze" Age, which played a role in promoting human civilization, was marked by the use of tin-copper alloy bronze. The element symbol of tin is Sn, which belongs to group IVA in the periodic table of elements, with an atomic number of 50 and an atomic weight of 118.69. Tin is stable at 13.2~161°C, and it is silvery white, that is, white tin.
How should tin wire be soldered
Nov 29, 2022
11-29
2022
1. Solder wire and solder flux
When soldering, solder wire and solder flux are also needed.
(1) Solder wire: For soldering electronic components, solder wire with rosin core is generally used. This solder wire has a low melting point and contains rosin flux, which is extremely convenient to use.
Disadvantages of Gold-Sn Alloy (Au-Sn) Solder
Nov 28, 2022
11-28
2022
The disadvantage of Au80%Sn20% solder is that it is more expensive, brittle, has a small elongation, and is not easy to process. In addition, due to the high melting point, it cannot be soldered with low melting point solder at the same time. It can only be used in situations where the chip can withstand a short-term higher than 300°C.
Analyze the advantages and specific uses of gold-tin alloy solder
Nov 28, 2022
11-28
2022
Gold-tin alloy is a kind of electronic welding, which has a good market and prospect. Gold-tin alloy uses gold-tin alloy solder in electronic applications. Gold-tin alloy is made by brazing technology, which is an important technology for assembling electronic products. In order to get the ideal brazing connection, the choice of brazing material is very important. The solderability, melting point, strength, Young's modulus, thermal expansion coefficient, thermal fatigue, creep and creep resistance of brazing materials can all affect the quality of brazing connections.
Application range of high temperature and low temperature solder paste
Nov 28, 2022
11-28
2022
When it comes to solder paste, I believe everyone knows what it is, but do you know about high temperature and low temperature solder paste?
The main difference between high-temperature solder paste and low-temperature solder paste is that the temperature of some chips cannot be high during the furnace, and bubbles will form when the temperature is high, but low-temperature solder paste may cause problems after the temperature is generated (higher) and some vibration pins , High-temperature solder paste is generally used for SMT components with high heat generation.
The working principle and characteristics of the solder paste thickness tester
Nov 28, 2022
11-28
2022
The solder paste thickness tester is a device that uses laser non-contact three-dimensional scanning intensive sampling technology to measure the thickness, area, volume, etc. This equipment is widely used in the field of SMT production and placement, and is an important measurement equipment for controlling the quality of solder paste printing.
How to use BGA chip laser solder balls for tin planting
Nov 25, 2022
11-25
2022
As mobile phones become more and more advanced, the degree of internal integration is also getting higher and higher, and almost all mobile phones now use ball grid array packaging modules, which is what we usually call BGA. This module is welded on the main board in the form of patch. BGA modules utilize the entire bottom of the package to interface with the circuit board. Instead of pin soldering, soldering is done with laser solder balls. And how is the BGA chip laser tin ball soldering process planted tin?
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Catherine
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