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Tin Ingot
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Tin Bar
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The difference between low temperature bismuth tin alloy and lead tin alloy
Oct 28, 2022
10-28
2022
Bismuth-tin alloy is an important part of solder. Generally, solders containing bismuth and melting point below 183 °C are included in fusible alloys. In bismuth-tin alloys, eutectic or hypoeutectic alloys with narrow temperature difference range are formed, and those that can implement temperature control requirements are called bismuth-tin alloys. Bismuth-tin alloys are gradually developed and extended on the basis of fusible alloys, bismuth-tin alloys and tin-lead solders. The two have both continuity and difference. The main differences with tin-lead solders are:
What are the steps in the whole soldering process of lead-free tin wire soldering
Oct 27, 2022
10-27
2022
We all know that the use of lead-free soldering materials will have a serious impact on the soldering process. Therefore, in the lead-free soldering process, the selection of soldering materials is the most challenging. Because for lead-free soldering process, the selection of lead-free tin wire, solder paste, flux and other materials is the most critical and most difficult. The type of solder components, the type of circuit board, and their surface finish should also be considered when selecting these materials.
Can the problems arising from the use of solder paste and lead-free solder be solved?
Oct 27, 2022
10-27
2022
The lead-free solder paste must first be able to truly meet the environmental protection requirements, and the lead cannot be removed, and new toxic or harmful substances are added; the solderability and post-soldering reliability of the lead-free solder must be ensured, and customers must be considered. costs and many other issues. In summary, lead-free solders should try to meet the following requirements:
How to make tin bars with strong anti-oxidation ability
Oct 26, 2022
10-26
2022
It is common to use tin bars in general soldering, and tin bars have the best diffusivity. They can be divided into two types: leaded tin bars and lead-free tin bars, both of which are used for circuit board soldering. Made of pure tin, good wettability and fluidity, easy to tin. The solder joints are bright, full, and will not be soldered and other undesirable phenomena. Add enough antioxidant elements, strong antioxidant ability. Made of pure tin, less tin dross, reducing unnecessary waste.
There is too much tin dross during the use of the tin bar.
Solder paste and flux paste are targeted materials in chip soldering
Oct 26, 2022
10-26
2022
We all know that lead-free solder paste is one of the indispensable solder materials in chip soldering. Leaded solder paste is particularly prominent in QFN, FPC, LED and other fields, and there are special solder pastes for SMT patch printing.
Soldering paste by material composition
Features and advantages of lead-free solder wire
Oct 25, 2022
10-25
2022
The research status of lead-free solder wire - the main component of lead-free solder is tin, the melting point is 232 ℃, and it forms an alloy system with other metals such as silver, bismuth, and zinc. The melting point of Sn-Ag system lead-free solder wire is 221℃, which is close to that of Sn-Pb system solder in many cases, and has many applications. In the Sn-Ag system, adding some copper appropriately, in addition to lowering the melting point, also improves the welding reliability.
Learn about solder paste printers
Oct 25, 2022
10-25
2022
The lead-free solder paste printing machine has an advanced timing belt adjustment mechanism. Because the adjustment mechanism of the synchronous belt in the traditional printing press is unreasonable, because the synchronous belt is matched with the synchronous gear through the belt teeth, when the synchronization is achieved, it is very important to adjust the adjustment mechanism reasonably, and the traditional parallel adjustment mechanism , the adjustment point and the synchronous wheel are not in a straight line, it is very inconvenient to adjust, and the tension cannot meet the requirements, which will cause a gap in printing
Rapidly developing lead-free solder paste products in smt soldering
Oct 24, 2022
10-24
2022
For lead-free solder paste, its metal composition is different in different application ranges. For example, silver-containing solder paste has relatively high conductivity, but the price is higher than that of tin-copper lead-free solder paste. In the process of SMT soldering in the electronics industry, solder paste has gradually evolved from lead to lead-free, mainly because lead-free solder paste is safer and healthier.
What is the difference between solid crystal solder paste and lead-free solder paste?
Oct 24, 2022
10-24
2022
1. It is tin powder: choose No. 5 or No. 6 powder with very small particles.
2. Packaging: Most of the packaging is 30ml or 10ml syringe packaging.
3. Function: It is mainly used to replace the silver glue welding core.
4. It is a flux paste, which can be welded with semi-non-metallic materials. Understand the coating of the core piece to understand.
Introduction of solder bars
Oct 21, 2022
10-21
2022
Solder bars produced by solder bar manufacturers are refined from high-purity metal raw materials and are used for wave soldering and manual dip soldering of electronic products. Under the strict quality control system and advanced smelting process, the harmful substances in the modified products, such as copper, cadmium, sulfur, zinc, aluminum, iron and oxides, are effectively controlled. The punch truly ensures a good and reliable solder joint. Product features: bright solder joints, beautiful, reliable and less corrosive. Good fluidity, less residue and short welding time.
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