We use cookies to improve your online experience. By continuing browsing this website, we assume you agree our use of cookies.
USD
EUR
GBP
CAD
AUD
CHF
HKD
JPY
RUB
BRL
CLP
NOK
DKK
SEK
KRW
ILS
MXN
CNY
SAR
SGD
NZD
ARS
INR
COP
AED
Home
Products
Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
Sn 99.99 Tin Ingot
Tin Bar
Lead-free Solder Bar
Tin Silver Copper Solder Bar
Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
Tin Balls
BGA Solder Balls
Lead-free Solder Balls
Pure Tin Ball
Sn99.95 Solder Balls
Tin Wire
Tin Copper Solder Wire
No-clean Tin Wire
Silver Tin Wire
Tin-Silver-Coppe Tin Wire
Solid Tin Wire
Rosin Core Tin Wire
Low-temperature Solder Wire
High-temperature Solder Wire
Solder Paste
Lead-free Solder Paste
No Clean Flux Paste
Low Temperature Solder Paste
Halogen Free Solder Paste
Medium Temperature Solder Paste
High Temperature Solder Paste
Solder Flux
Environmentally Friendly Flux
No-Clean Flux
Tin Alloy
Tin Phosphorus Alloy
Tin Bismuth Alloy
News
Company News
Industry News
About Us
Contact Us
Inquiry
FAQ
Home
Products
Tin Ingot
Sn 99.90 Tin Ingot
Sn 99.95 Tin Ingot
Sn 99.99 Tin Ingot
Tin Bar
Lead-free Solder Bar
Tin Silver Copper Solder Bar
Sn99 Ag0.3 Cu0.7 Tin Bar
High Temperature Resistant Pure Tin Bar
High Purity Tin Bars
Antioxidant Solder Bar
Low Temperature Tin Bar
No-clean Tin Bar
sn99.95 Tin Bar
Tin Balls
BGA Solder Balls
Lead-free Solder Balls
Pure Tin Ball
Sn99.95 Solder Balls
Tin Wire
Tin Copper Solder Wire
No-clean Tin Wire
Silver Tin Wire
Tin-Silver-Coppe Tin Wire
Solid Tin Wire
Rosin Core Tin Wire
Low-temperature Solder Wire
High-temperature Solder Wire
Solder Paste
Lead-free Solder Paste
No Clean Flux Paste
Low Temperature Solder Paste
Halogen Free Solder Paste
Medium Temperature Solder Paste
High Temperature Solder Paste
Solder Flux
Environmentally Friendly Flux
No-Clean Flux
Tin Alloy
Tin Phosphorus Alloy
Tin Bismuth Alloy
News
Company News
Industry News
About Us
Contact Us
Inquiry
FAQ
News
Home
>
News
In the process of using tin strip, too much tin slag is produced, how to deal with it?
Aug 23, 2022
08-23
2022
In the process of wave soldering, tin bars will produce tin dross, but sometimes too much tin dross is found. At this time, we should pay attention to whether there is any problem.
First of all, we should distinguish whether the tin slag that appears is normal tin slag. Generally, the tin slag in the form of black powder is normal, while the tin slag in the form of tofu slag is abnormal. In view of this situation, we analyze the reasons for the following points:
1. In this case, the main reason is because of the problem of the wave furnace of the wave soldering equipment. At present, the design of many wave furnaces is not ideal. The wave peak is very high, the distance between the peaks is too wide, and the distance between the double wave furnaces is too close. There are also rotary pumps used in the equipment, which are all possible causes of tin dross. If the wave peak is too high, the deviation of the temperature reduction may become larger during the process of the solder falling from the peak to the peak, and the solder will be mixed with air, causing oxidation or semi-dissolving of the solder, resulting in the generation of tin dross. If the preventive measures of the rotary pump are not done well, the tin slag will be continuously pressed into the furnace, and the chain reaction of the loop will aggravate the generation of the problem tin slag.
2. The temperature is too low, and the temperature control of wave soldering is relatively low, generally 280 °C ± 5 °C, and this temperature is the minimum temperature required in the solder melting process, and the temperature is lower than the tin can not achieve good melting , indirectly causing excessive tin dross.
3. Missed the most suitable tinning time. In the wave soldering process, the time of adding tin strips is also very critical. The most suitable time is to always keep the distance between the tin surface and the peak as short as possible.
4. The tin slag in the furnace is not cleaned in time, and whether the tin slag is regularly cleaned is also one of the reasons for the problem. Too much tin slag in the furnace will cause the solder falling from the peak to not fall into the furnace as soon as possible, but Staying on the dross leads to uneven heating, thus causing excessive dross.
5. Is there a regular cleaning of the wave furnace? If the wave furnace is not cleaned for a long time, the impurity content in the furnace will be high, which will also lead to excessive tin slag.
When using solder wire, how should the working temperature be reasonably controlled?
Aug 23, 2022
08-23
2022
1. When soldering the solder wire, the working temperature should be effectively controlled, so as to ensure that the solder wire has a good welding effect. When soldering the solder wire, it should be avoided to put the appropriate solder wire into the tin pot, connect it to the tin pot, turn the power switch over and adjust the working temperature to about 250 degrees Celsius, and use the solder wire to coat the red heating tube. The disposal of the tin ensures that the entire tin surface can completely cover the heating tube. When the solder wire is melted, the solder wire should be added appropriately to ensure that the temperature of the tin surface is maintained at a relatively appropriate value.
2. When the solder wire is in use, if there is solder wire left in the tin furnace, do not cut off the heating power supply of the tin furnace. At this time, the working temperature should be adjusted appropriately to avoid accelerating the oxidation reaction of the tin surface. Usually we can control the working temperature of 63/67 solder wire at about 250 degrees Celsius, 50/50 solder wire should be controlled at about 280 degrees Celsius, and 30/70 solder wire should be controlled at about 300 degrees Celsius. .
2.When investigating the working temperature of the tin furnace of the solder wire, you should not simply check the appearance of the tin furnace itself, which will cause a relatively large error. You should use a special thermometer to pierce the tin furnace for testing. Usually high temperature solder The working temperature of the wire should be controlled within 400-500 degrees Celsius. If the working temperature is not reached, there will be problems with continuous welding and solder joints not shining. Therefore, when using solder wire for welding, the working temperature should be strictly controlled, so as to ensure the welding quality of the solder wire.
Chemical composition of lead-free solder paste
Aug 15, 2022
08-15
2022
The composition of lead-free solder paste is very complex, usually made by mixing metal solder powder, flux and other chemical additives evenly. Through a series of operations by the solder paste manufacturer, a milky mixture will be formed later. Solder paste will have a certain viscosity at room temperature. During the SMT patching process of the circuit board, the electronic components can be firmly adhered to a specific position. The factory does not collapse after the solder paste is patched during the SMT patching process. Stabilize electronic components.
During the secondary soldering process of reflow soldering, with the continuous volatilization of some solvents and additives in the solder paste, the solder paste will collapse slightly. Melted to form a strong metallurgical bond between the circuit board and the electronic components, thereby permanently connecting the soldered electronic components and the circuit board.
There is flux in the composition of lead-free solder paste. This material can not only remove metal oxides from circuit boards and electronic components, but also adhere to the surface of electronic components and circuit boards after melting, thereby preventing The two are oxidized twice, and the flux component in the lead-free solder paste forms a liquid after melting, and can also achieve the effect of assisting heat conduction. The components in the flux can promote the melting of the metal components in the solder paste and wet the metal surfaces waiting to be soldered on circuit boards and electronic components. At the same time, it can also reduce the tension on the surface of the solder paste. The flux components in the lead-free solder paste not only play the above important roles, but also can be used as a carrier of metal alloy powder in the production process of Xinfujin solder paste manufacturers.
The main components of lead-free solder paste can be mainly divided into the above-mentioned: activator, thixotropic agent, resin and solvent, etc. Among them, the flux is also the activator. The choice of flux is very important, usually a good one Lead-free solder paste should have good wetting properties, thermal collapse resistance, and good bonding properties, which are mainly reflected by the composition of the flux.
Melting point 300℃ high temperature solder paste characteristics
Aug 15, 2022
08-15
2022
1. Excellent performance of solder paste
The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.
2. How to use solder paste
The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.
1. Excellent performance of solder paste
The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.
2. How to use solder paste
The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.
3. How to store solder paste
Solder paste should be avoided from being exposed to the air for a long time. It can be stored in the refrigerator at 0℃-10℃. Please take it out of the refrigerator and return to temperature before use. It can be stored in the refrigerator for about half a year without deterioration.
1. Excellent performance of solder paste
The solder paste has good printing performance and can be printed or dispensed for a long time without any abnormality. The solder paste has a good demolding effect, which can meet the requirements of micro-grain size chip packaging welding. There are few residues, and the insulation resistance is high, and the residues are free to be cleaned. If cleaning is required, organic solvents can be used for cleaning. After cleaning, the insulation resistance and reliability are better.
2. How to use solder paste
The 300°C melting point solder paste is developed for high-power semiconductor packaging. It has a wide process window and is suitable for packaging operations by electronic component manufacturers. It has high production yield and good welding performance. For printing and dispensing operations, the solder paste has good solderability, high soldering yield, low porosity of solder joints after soldering, and good electrical properties. After dispensing or printing, it can be soldered by heating methods such as reflow oven, tunnel oven, and constant temperature oven.
3. How to store solder paste
Solder paste should be avoided from being exposed to the air for a long time. It can be stored in the refrigerator at 0℃-10℃. Please take it out of the refrigerator and return to temperature before use. It can be stored in the refrigerator for about half a year without deterioration.
Solder paste quality inspection steps:
Aug 12, 2022
08-12
2022
1. For solder powder detection, the particle size of tin powder can be measured with a high magnification microscope to check the distribution of tin powder particles. It is relatively high, which proves that the quality of this solder paste solder powder is relatively good, and it will not affect the quality of SMD printing on the stencil.
2. Use atomic absorption spectrometer to measure the chemical elements in the solder paste. Usually the detection items are the content of harmful metal elements such as lead, mercury and cadmium. If the solder paste is a halogen-free solder paste, it is also necessary to check the halogen in the solder paste in advance. Does the content meet the standard?
3. In the viscosity test, the viscosity of the solder paste will greatly affect the printability of the solder paste on the screen. If the viscosity of a solder paste is large, the slump performance will be greatly improved, but the printability will be poor. It may affect the release effect, and the solder paste may stick to the stainless steel mesh, resulting in poor printing.
4. Stencil printability test, the use of smt stencil to print solder paste is an indispensable step in the patch welding process, so it is essential for a solder paste to have good printability, so the IQ C department can Take a small amount of solder paste and perform a printability test to verify that the stencil printability of this solder paste is good.
5. Test the solderability of the solder hook. The sweatability of the solder paste can be divided into wettability and solderability. This function is mainly to test whether the solder paste will dry out. If it does not dry out, the connection strength after soldering meets the requirements. requirements? This step of checking whether it is good or bad can be tested using discarded circuit boards and electronic components that have been disassembled.
6. Whether the solder joints are full and shiny, this detection step can be done by pasting the solder paste on the glass and reflow soldering. After the soldering is completed, it can be observed with the naked eye to see whether the solder joints are shiny. It can also be seen from the glass whether there is a lot of residue after solder paste soldering?
Through the above steps, we can basically judge the quality of a solder paste intuitively or from data, whether the solder paste is lead, lead-free or silver-containing, an experienced electronics factory can pass each The data of each test is summarized and organized into a table, and the quality of the solder paste is verified by analyzing the results of each test.
Use method and precautions of solder paste
Aug 12, 2022
08-12
2022
For many newly established SMT beginners or production line managers, the straight through rate of SMT production line is the top priority, 60%-70% of the defective rate is generated in the welding process. Most of the reasons are related to the improper use and storage of solder paste, how to store and use, and what problems should be paid attention to in the process of use. Analyze the problems and hope to help electronic foundry or SMT chip processing department to better understand the use of solder paste.
1. How to store the tin paste
The paste should be sealed and stored in the refrigerator at 2-10 degrees Celsius. Xinfu Jinxi paste is generally valid for 3-6 months. Use the queuing mechanism, using the first in first out principle.
How to use solder paste
1. The regeneration
After the solder paste is removed from the refrigerator, condensation will occur immediately on the surface of the solder paste bottle due to the low storage temperature, and the water vapor in the air will also condense. Do not open the cap immediately after taking it out of the tin can. The paste must be placed at room temperature for 2-4 hours to return the temperature to the natural ambient temperature (25±3C). It is strictly prohibited to use external heating device to reheat the solder paste quickly.
1
...
40
41
42
43
44
45
46
page:
Go
Ottilia
Daisy
fannie
Caroline liu
Leave us your e-mail address and we'll give you a free consultation.
1. Price reference LME, more favorable 2.Transportation is safer and more reliable with CRF.