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Instructions for handling lead-free solder fluxes
Oct 14, 2022
10-14
2022
1. The specific gravity of the solder flux is generally 0.810~0.830 (20°C), and the specific gravity of the solder flux varies with the temperature. Each time the temperature increases by one degree, the specific gravity of the solder flux decreases by 0.001. The actual operation can be appropriately increased or decreased according to the temperature of the job site. Make sure the working conditions are consistent.
What is the reason for the bad balling of solder paste?
Oct 14, 2022
10-14
2022
BGA balling often encounters defects such as under-soldering, misalignment of solder balls, missing solder balls and insufficient solder volume, which are usually caused by insufficient fixing force or insufficient self-centering force to the ball during reflow. Insufficient holding force can be caused by low viscosity, high barrier thickness or high outgassing speed; while insufficient self-setting force is generally caused by weak solder flux activity or too low solder volume.
How to understand the characteristics of high temperature solder paste?
Oct 14, 2022
10-14
2022
1. High temperature solder paste printing has good rolling and tinning properties, and can also complete good printing for pads as low as 0.3mm pitch;
High temperature solder paste
2. During continuous printing, its viscosity changes very little, the stencil has a long operational life, it will not dry out for more than 8 hours, and it still maintains a good printing effect;
Performance Requirements for Lead-Free Solder Flux
Oct 14, 2022
10-14
2022
1. The lead-free solder flux must have good thermal stability (to ensure that it will not decompose and fail at higher solder temperatures.);
2. The lead-free solder flux must have a certain chemical activity (to ensure the ability to remove the oxide layer);
3. Lead-free solder flux should have good wettability and promote the expansion of solder (to ensure better soldering effect);
Excellent properties of lead-free solder paste
Oct 12, 2022
10-12
2022
(1) The solder paste co-current peak temperature is low and the reflow time is short. Excessive reflow peak temperature or long reflow time will cause different degrees of damage to components and PCBs, and also increase energy consumption. Therefore, under the premise of ensuring the soldering quality of solder paste, it is of great significance to reduce the peak reflow temperature or shorten the reflow time for the reliability of electronic products. By adjusting the reflow process, the peak temperature of our lead-free solder paste can be reduced to 230°C, and good solder joint quality can be obtained at the same time.
The composition of solder wire and common problems
Oct 12, 2022
10-12
2022
We produce leaded solder wire and lead-free SNCU solder wire inside is hollow, this The design is to store the flux (rosin), so that the flux can be added evenly when adding solder. The role of the solder wire: to meet the electrical conductivity requirements of components on the circuit and the fixing requirements of components on the PCB board.
Solder wire specification classification
Oct 12, 2022
10-12
2022
According to different situations, solder wire has several classification methods:
Classified by metal alloy material: can be divided into tin-lead alloy solder wire, pure tin solder wire, tin-copper alloy solder wire, tin-silver-copper alloy solder wire, tin-bismuth alloy solder wire, tin-nickel alloy solder wire and special tin-containing alloy material of solder wire;
Types of solder commonly used in electronic industry welding
Oct 12, 2022
10-12
2022
(1) Filament solder - usually called solder wire, with rosin flux in the center, called rosin core wire, which is commonly used in manual soldering.
(2) Sheet solder - commonly used in the welding of silicon wafers and other sheet welds.
(3) Ribbon solder - commonly used in automatic assembly production lines, an automatic welding machine is used to punch a section from the ribbon-shaped solder for welding to improve production efficiency.
(4) Solder paste - It is made by mixing solder and flux powder together. It has been widely used in the automatic patch process.
What should I do if there is a tin bead phenomenon when the solder wire is used?
Oct 09, 2022
10-09
2022
When the solder wire is used for soldering, the solder meets the high-temperature soldering iron at the pad, melts due to the high temperature, and the liquid tin spreads rapidly with the help of the flux to be firmly connected to the pad. At this time, there may be two situations that lead to the phenomenon of poor tin frying under the welding process. The following is an introduction to the phenomenon of solder balls appearing when the solder wire is used:
Can solder paste completely replace solder?
Oct 09, 2022
10-09
2022
Whether solder paste can replace solder, I believe some people will have this question. When it comes to solder paste and solder work, the final result is to weld components firmly, but whether they can be replaced, the specific analysis is as follows :
First of all, solder paste is a paste-like solid that is uniformly mixed with solder alloy powder and flux carrier system in a certain proportion; the viscosity of solder paste has rheological properties,
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Catherine
Fannie
Avril
Chtherine
Fannie
Avril
