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Analysis of lead-free environmental protection tin bar welding
Sep 26, 2022
09-26
2022
We often encounter many problems in welding. Let's talk about the following reasons why the solder joints do not shine after the lead-free environmental protection tin bars are welded:
1. The tin content of the lead-free environmental protection tin bar determines the brightness of the tin point. The surface of the tin and lead-tin metal elements, which are part of the tin bar, has a bluish white luster, while the surface of the lead metal element is gray. The higher the tin, the brighter the tin point. On the contrary, the higher the lead content of the solder bar, the duller the tin point.
Causes of solder slag from lead-free environmentally friendly tin bars
Sep 26, 2022
09-26
2022
Lead-free environmentally friendly tin bars will also produce solder slag during the welding process, which is a normal oxidation phenomenon. The lead-free environmentally friendly tin bar is made of pure tin and trace copper. Antioxidants are added to it. Compared with traditional tin bars, it has high wettability, good fluidity, and is easier to tin. At the same time, the solder joints are bright and full, and there will be no false soldering. It has become the main choice for wave soldering today. So what causes solder slag?
Reasons for poor scratching of lead-free solder paste
Sep 23, 2022
09-23
2022
The scraping pit is in the process of solder paste printing, the scraper moves back and forth continuously, the scraper scrapes the lead-free solder paste at the opening of the stencil to form poor scraping, and the solder paste at the opening of the stencil is scraped away. This will lead to less tin on the circuit board. After reflow soldering, the solder joints with less tin have insufficient welding strength and lack the proper support for electronic components, resulting in welding defects. The occurrence of scraped pits and less tin can first rule out the reasons for the product quality of lead-free solder paste manufacturers. Usually, poor scraping pits are closely related to the processing process of SMT manufacturers. This defect is found in the actual process of bad production lines. It has a greater relationship with the solder paste printing stencil and the squeegee.
Mechanical properties of lead-free solder wire
Sep 23, 2022
09-23
2022
The reliability of lead-free solder wire depends not only on intrinsic characteristics, but also on the design and components and boards to be mounted, the process used to form the solder joints, and the long-term use environment. Also, the properties of the solder joints are different from those of the bulk lead-free solder wire.
Matters needing attention in the health and safety of lead-free solder wire
Sep 23, 2022
09-23
2022
Solder wire is an important industrial raw material for connecting electronic components in welding lines, and is widely used in the electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life.
This product does not contain regulated specific chemical substances, nor does it contain organic fluxes as specified in the Organic Poisoning Prevention Rules, but necessary precautions are still required to ensure human health and safety.
What are the characteristics of lead-free solder wire?
Sep 23, 2022
09-23
2022
Lead content has always been a controlled part of solder wire, and the ultimate goal of industry efforts is to minimize lead content. The emergence of lead-free tin wire has solved a major problem for people in the industry, won the recognition of the world, and has become an important part of China's export products, especially exported to European and American countries. The reason why lead-free solder wire has won so much applause is because it has the following characteristics compared with lead-free solder wire;
Melting point of lead-free low temperature solder paste
Sep 22, 2022
09-22
2022
In the whole soldering industry, there are many styles of solder paste, not only low temperature, but also medium and high temperature solder paste. There are even solder pastes with a high temperature of more than 300 degrees and 400 degrees. Today we talk about the melting point of low-temperature solder paste. It is common sense that the melting point of low-temperature solder paste is 138 °C, which is called low-temperature solder paste. Compared to 6337 eutectic solder paste at 183°C, its temperature is very low. This solder paste is generally used in the low-temperature SMT reflow process.
Considerations when choosing flux cored tin wire
Sep 22, 2022
09-22
2022
The preparation of flux-cored tin wire is relatively complicated, and the process control is strict, including: smelting, casting, extrusion, rough drawing, fine drawing and wire winding and other processes. How to ensure the uniformity of the flux in the tin wire and avoid broken rosin defects is the whole The most critical process in the tin wire process.
Consider the following factors when selecting flux cored wire:
Analysis of the Causes of Soldering Points of Flux-cored Tin Wires
Sep 22, 2022
09-22
2022
Analysis of the reasons for the solder joints of flux cored tin wires:
1. The flux is in poor contact with the bottom surface; the floor and the welding angle are improper
2. The specific gravity of the flux is too high or too low, and the original bottom plate and leads are not handled properly.
3. The transmission speed is too fast or too slow; the standard speed is 1.2-1.5M/min. When it is too fast, the solder joint will be sharp and shiny; if it is too slow, the solder joint will be slightly round and stubby;
Soldering standard for flux cored tin wire
Sep 22, 2022
09-22
2022
Flux cored tin wire test welding, the solder joint should be smooth and shiny. No false welding, virtual welding phenomenon. Adjust the tin furnace temperature to 270±10℃, when the specified temperature is reached, the tin bar should melt. The molten soup should be shiny and free of impurities. Hold the tin wire in one hand and the soldering iron in the other hand, and put the soldering iron on the pins. When the pins are hot, put the solder wire on the joint of the soldering iron and the pins. When the amount of tin is almost the same, remove the soldering iron and the tin wire at the same time. . But this way I often get the pins very hot, and the tin is not enough, and the tin sometimes hangs on the soldering iron and doesn't flow down.
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